HEAT CONDUCTING FOIL NEOGRAF

“I like to use HITHERM HT-C3200 wherever high semiconductor ground temperatures and high alternating loads are expected. Pump-out effects or drying out of the alternative heat-conducting paste is a thing of the past.”

Daniel Rückert

Logo

NEOGRAF SOLUTIONS, LLC, LAKEWOOD, USA

Measurements by our customers confirm our own practical experience: Reliable thermal function over the entire life cycle of the semiconductor. Just as it should be.

Our partner:

NeoGraf Solutions. The reliable thermal interface for challenging applications. eGRAF® HITHERM™ thermal interface materials (TIMs) are designed for long-term, critical applications with extreme heat cycles. HITHERM™ TIMs are made of flexible graphite, which has been specially developed for challenging lighting, computer and power electronics applications. 

Our recommendation:

HITHERM™ HT-C3200 thermal interface foil (TIM)

  • Compressible graphite foil
  • Thermal conductivity comparable to screen printing with heat conducting paste
  • Simple and clean assembly and disassembly
  • No pump-out effect
  • No drying out
  • Defined and reproducible thermal interface
  • High reliability even in high temperature ranges (ideal for SiC)

We would be delighted to advise you.

FURTHER INFORMATION

  • pdf-icon
    AET-Thermal-Interface-Pads
    download-icon
  • pdf-icon
    HITHERM-HT-C3200
    download-icon

YOUR CONTACT PERSONS FOR COMPONENTS

NORTH GERMANY (ZIP 0-5)

SOUTH GERMANY (ZIP 6-9)

FOREIGN COUNTRIES

nach oben